| http://www.w3.org/ns/prov#value | - For example, the adhesion/barrier layer at the bottom of the adhesion/barrier/seed layer 8011 may be formed by sputtering a titanium layer with a thickness of between 0.02 and 0.8 ??m, and preferably of between 0.05 and 0.5 ??m, on a polymer layer 95 and on pads, principally made of aluminum, exposed by openings 950 in the polymer layer 95.
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