PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • The chip carrier of the present invention, particularly a multi-layer structure having a compensator, dielectric and power planes, is manufactured according to the following steps.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com