| http://www.w3.org/ns/prov#value | - Referring to FIG. 2D, a conductive layer 222 is formed on the metal layer 221, surfaces of vias 220, and a portion of the electrode pads 231, 231??? by physical deposition or chemical deposition, such as sputtering, evaporation, arc vapor deposition, ion beam sputtering, laser ablation deposition, plasma-enhanced chemical vapor deposition, or electroless plating.
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