About: http://webisa.webdatacommons.org/198067778

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Further, the present invention is a method for manufacturing a bump-attached wiring circuit board in which bumps are formed on a wiring circuit, comprising the steps of:
http://www.w3.org/ns/prov#wasQuotedFrom	google.com