| http://www.w3.org/ns/prov#value | - For example, the resist is typically spin-coated or otherwise applied to a substrate such as a silicon wafer, then pre-exposure baked on a hot plate at 60 to 150??? C. for 1 to 10 minutes, and preferably at 80 to 120??? C. for 1 to 5 minutes, so as to give a resist film having a thickness of 0.5 to 2.0 ??m.
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