About: http://webisa.webdatacommons.org/200994873

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention is a structure and a method of packaging memory chips in a 3-D form factor on a flex circuit while keeping individual chips independent in a way such that each one of them can be replaced freely.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com