| http://www.w3.org/ns/prov#value | - The conductive elastic member 8 is formed by bonding a highly ductile metal, such as gold, to the substrate pad 6 by wire bonding or welding, using the bump bonder 20, for example, as shown in FIG. 30, and then forming the top surface thereof into a concave shape by pressing it with a capillary or wedge, or bonding a conductive rubber having a concave shape to the substrate pad 6.
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