About: http://webisa.webdatacommons.org/201244670

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	DETAILED DESCRIPTION OF THE INVENTION [0021] The present invention is an apparatus and method for mechanical and/or chemical-mechanical planarization of substrates used in the manufacturing of microelectronic devices.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com