PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • The present invention may be applied to a semiconductor chip (e.g., a silicon wafer) and/or to a carrier (e.g., a substrate such as a silicon wafer or an alumina plate) to which the semiconductor chip may be attached.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.fr