About: http://webisa.webdatacommons.org/202178061

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Similarly to the conventional method, the BGA type semiconductor device 12 is first packaged on the ceramic wiring board 11 by fixing means such as solder or the like.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com