| http://www.w3.org/ns/prov#value | - The films 15, which are formed on the opposing faces 3d of common signal inner leads 3, are composed of an organic material such as epoxy, polyether amide, and epoxy modified polyimide, or metals such as Cu, and is bonded by a plating method, thin film forming method, or thick film forming method such as coating, etc.
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