| http://www.w3.org/ns/prov#value | - A process as recited in claim 8 wherein said copper plating step includes A. electrolessly depositing a copper flash on said board, B. depositing an electroplating resist to said board except at areas adjacent and through said holes, and C. electroplating copper onto exposed areas of said board. 7 mg I UNITED STATES PATENT OFFICE CERTIFICATE OF CORRECTION P n 3,742,597 Dated July 3,1q72 Inventor(s
|
