| http://www.w3.org/ns/prov#value | - A principal embodiment of the invention is a composition for chemical-mechanical polishing a semiconductor or memory device substrate, comprising: a fluid comprising at least one per-type oxidizer that produces free radicals, preferably an Oxygen/Hydroxyl Free Radical, when contacted with at least one activator, wherein the activator is one or more transition metals that promote production of the
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