| http://www.w3.org/ns/prov#value | - 20090116205MOUNTED STRUCTURE - A plurality of semiconductor elements is adjacently mounted on a substrate by a solder with a melting point of 200?? C. or lower, an electronic part other than the semiconductor elements is mounted on the substrate between the adjacently mounted semiconductor elements by a solder with a melting point of 200?? C. or lower, and spaces between the plurality of semicondu
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