| http://www.w3.org/ns/prov#value | - posits an insulation film on a region except the region of an upper portion of the silicon nitride film by a thermal oxide process; (22) step which forms a tip array on the silicon nitride film within the mold; (23) step which removes the first semiconductor substrate after bonding a second semiconductor substrate on the insulation film and the tip array; and (24) step which etches to exposures an
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