| http://www.w3.org/ns/prov#value | - Specifically, the first object of the present invention is to reduce the internal stress and increase the adhesivity of the dielectric layer so that, in particular, bending of the medium and cracks and peeling of the layer due to deterioration of the interface between the substrate and the dielectric layer are prevented, and defects such as pin holes are also prevented, whereby the reliability or
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