About: http://webisa.webdatacommons.org/208009159

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Cutting of the wafer into bars is generally accomplished by cleaving the wafer through the substrate side, using an instrument such as a razor blade, knife, scapel blade or the like.
http://www.w3.org/ns/prov#wasQuotedFrom	google.es