About: http://webisa.webdatacommons.org/209003041

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention relates to a semiconductor chip package, and more particularly to a package with multiple stacked semiconductor chips and a manufacturing method of the package.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com