| http://www.w3.org/ns/prov#value | - This patent application, including the references contained therein, is hereby incorporated in its entirety by reference.Related U.S. Pat. No. 5,331,203, filed Apr. 5, 1990, by Wojnarowski et al., and entitled A High Density Interconnect Structure Including a Chamber teaches bonding the chip containing a sensitive structure into a deep chip-well.
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