| http://www.w3.org/ns/prov#value | - Among the the ???big four??? challenges faced by Globalfoundries faced over the next three years are: packaging, the transition to 450-mm, the cost of lithography/EUV and moving to new device architectures, including super-steep retrograde wells, fully-depleted silicon-on-insulator (FDSOI) and FinFETs.
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