| http://www.w3.org/ns/prov#value | - Thereafter, as illustrated in FIG. 21(e), a via-hole metal 51 comprising laminated metal films of Ti(50 nm)/Au(2 ??m) is plated on a region including the surface of the inter-wiring insulating film 72 on the electrical resistance structure and the inner surface of the hole 25a.
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