PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • The wafer 145 can then be cut by laser or other suitable means to separate each die from the complete wafer 145.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com