PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • Plasma processes, such as plasma enhanced chemical vapor deposition (PECVD), are increasingly being used to replace thermal processes in the deposition of low dielectric constant films including silicon, carbon, and oxygen.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.fr