PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • FIG. 7 illustrates a multi-die semiconductor assembly 62 in which lower die 42 is a center bonded die such as shown in FIG. 2 and upper die 44, shown in dashed lines, is longer but narrower than lower die 42.
http://www.w3.org/ns/prov#wasQuotedFrom
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