About: http://webisa.webdatacommons.org/21511284

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention particularly relates to an apparatus and method for the chemical-mechanical planarization of a surface of a semiconductor wafer.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com