About: http://webisa.webdatacommons.org/216389702

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention is directed toward polishing pads and planarizing machines in mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays or other microelectronic substrate assemblies.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com