About: http://webisa.webdatacommons.org/216588231

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Then, the via-holes 306 are formed through the first silicon substrate 302 using an etching process or the like, and the first conductive material 308 is filled in the first via-holes 306 by a process such as plating or sputtering.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com