| http://www.w3.org/ns/prov#value | - The thinned wafer is supported throughout the entire process reducing warpage, stress and process complexity compared to other processes that require high-temperature exposure and stress to the thinned wafer, or solvents to release the temporary bonding material. 3M's WSS enables wafer processing currently in high-volume production at multiple semiconductor sites worldwide.SUSS MicroTec is a reco
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