About: http://webisa.webdatacommons.org/222835740

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Major components including the semiconductor chip 11, the bonding areas of the lead terminals 15, and the bonding wires 16 are encased by a molded body 17 of thermosetting resin such as an epoxy resin, thus producing a package.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com