About: http://webisa.webdatacommons.org/225423248

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The semiconductor device 10 is subjected to heat when it is mounted on a printed circuit board, and especially the bottom portion of the plastic package 16 is influenced by the heat stress.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com