| http://www.w3.org/ns/prov#value | - The heat spreader 142 is preferably a highly thermally conductive material, including but not limited to, copper, aluminum, and alloys thereof. [0041] It is, of course, understood that the microelectronic die package 150, as shown in FIG. 11, can be fabricated simultaneously with a number of other microelectronic die packages.
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