About: http://webisa.webdatacommons.org/230475076

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Thus, conductive bumps can be tested at a wafer level and bumping information such as numbers and/or locations of the malfunction bumps formed can be instantaneously obtained.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com