About: http://webisa.webdatacommons.org/233101323

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The package is formed into a substrate, such as a printed circuit board or a ceramic substrate, through which an opening has been formed to receive a thermally conductive slug, formed of a material such as copper.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com