| http://www.w3.org/ns/prov#value | - This semiconductor wafer rinsing system 100 includes a process of performing a surface treatment, for example, on a bare pattern formed by partially exposing the surface of a semiconductor wafer coated with an oxidation film using a rinsing solution such as a deionized water, a mixed solution of an acid and deionized water, or a mixed solution of an alkali and deionized water.
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