PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • Through vias 107, as their name suggests, extend through the wafer substrate and enable an electrical connection to be made to an element such as a circuit board, external device, or the like that is in proximity.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com