About: http://webisa.webdatacommons.org/233673953

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The heat-dissipating device of claim 1, 2, or 3, wherein the thermally-conductive piece is dimensioned in such a manner as to allow a surface thereof to come into direct contact with the front side of the IC chip.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com