About: http://webisa.webdatacommons.org/233714442

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The back side of the at least one bond pad located on the active surface at the top of the at least one via may be exposed by a process, such as etching, to remove unwanted portions of the second dielectric layer.
http://www.w3.org/ns/prov#wasQuotedFrom	google.es