| http://www.w3.org/ns/prov#value | - When collars 50???, depicted in FIGS. 4-6, are being fabricated on a substrate, such as semiconductor device 10, having conductive structures 20??? already secured to the contact pads 12 thereof, some of material 86 may be located in shadowed areas 54??? (see FIGS. 5 and 6) lying under portions of a conductive structure 20???.
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