| http://www.w3.org/ns/prov#value | - Another embodiment of the present invention is a method for manufacturing a semiconductor wafer, comprising (1) a lapping step of lapping the wafer surface, (2) a polishing step of specularly polishing the wafer surface and (3) a cleaning step using the above-described cleaning agent composition and a cleaning step using a cleaning agent containing an ammonia and a hydrogen peroxide.
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