PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • In another aspect, the invention relates to a structure including a heat sink, a solderable material, and a single layer of thermally-activated bonding material disposed between the heat sink and the solderable material.
http://www.w3.org/ns/prov#wasQuotedFrom
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