| http://www.w3.org/ns/prov#value | - FIGS. 2A and 2B are a plan view illustrating the step of upsetting the center of a die pad which is included in the fabrication process of a plastic-encapsulated semiconductor device of the first embodiment, and a cross-sectional view taken along the line IIB???IIB shown in FIG. 2A, respectively.
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