| http://www.w3.org/ns/prov#value | - Next, as shown in FIG. 2E, the inner lead portions of the lead frame 11, islands 16-1 and 16-2, chips 12-1 and 12-2 and resin tape 14 are molded with resin such as epoxy resin by an adequate molding technique such as the transfer molding technique so as to form the package 15.
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