| http://www.w3.org/ns/prov#value | - In a method of operation according to a further embodiment of the present invention, a microelectronic package 20, such as the package described above with reference to FIGS. 1A and 1B, is tested by juxtaposing the conductive posts 42 with contact pads 60 on a second microelectronic element 62 such as a circuitized test board (FIGS. 2A and 2B).
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