About: http://webisa.webdatacommons.org/24033198

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Of course, the Au-Sn solder bumps are formed through other processes such as a plating or a vacuum evaporation.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com