| http://www.w3.org/ns/prov#value | - Such a multi-chip module 70 assembly may be packaged, as known in the art, such as by applying a suitable encapsulant material 30 (e.g., a glob-top type encapsulant, a transfer molded or pot molded type encapsulant, etc.) over at least portions of semiconductor devices 36, 36???, the intermediate conductive elements (e.g., bond wires 32, 32???), and at least portions of the interposer 20.
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