About: http://webisa.webdatacommons.org/245926384

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The conductive interconnects 44U can be formed using a bumping process, such as solder ball bumping, stud bumping or reflow bonding.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com