| http://www.w3.org/ns/prov#value | - When the alloy material 216 is comprised of copper, the reactant within the alloy material 216 such as tin or zirconium preferably has a low solid solubility in copper such that the reactant easily migrates out from the alloy material 216 along the top surface and along the grain boundaries of the conductive fill 218 during the relatively high temperature thermal anneal process.
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