About: http://webisa.webdatacommons.org/246832363

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Thus, there is a problem in that the solder ball 10 cannot be appropriately provided to the substrate 2 having the through hole 14 whose diameter L2 is small even if the ball mounting method shown in FIG. 5 is used.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com