About: http://webisa.webdatacommons.org/249890191

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	FIG. 1 is an exemplary layout of bonding pads and electrically-conductive paths of the present invention, forming a universal interconnect die.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com