| http://www.w3.org/ns/prov#value | - FIGS. 11A to 11C are a plan view when viewed from the bottom surface of a first variation of the resin-encapsulated semiconductor device of this embodiment, a cross-sectional view taken from line Xb-Xb of the resin-encapsulated semiconductor device, and a perspective view of the appearance of the resin-encapsulated semiconductor device, respectively.
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